Plasma Prep Reactive Ion Etcher (RIE)

Overview

The Plasma Prep RIE is a tabletop reactive ion etching system that provides anisotropic, directional dry etching at a moderate cost compared to full production RIE tools. It replaces dangerous wet etching, which tends to undercut features, with a uni-directional dry plasma etch controlled through a touch-screen interface with automatic monitors and interlocks. The system uses a shielded quartz chamber with an 8 inch sample stage and runs on oxygen, CF4, argon, and other process gases. It requires external water cooling of the stage and an external mechanical pump, with an optional integrated turbo pump available. Typical applications include final package removal, glass passivation layer removal, deep etching, and contaminant removal.

Anisotropic, Directional Etching

Unlike a barrel-style isotropic etcher, the RIE produces a uni-directional etch that avoids the undercutting seen with wet chemical or isotropic dry etching. This makes it suitable for fine-feature failure analysis work such as passivation layer removal and deep etching where sidewall control matters.

Touch-Screen Process Control

All gas, pressure, and RF power settings are entered and monitored through an LED touch-screen control system with automatic monitors and interlock controls that protect both the equipment and the sample. A process timer supports repeatable, reproducible runs.

Typical Applications

The Plasma Prep RIE is commonly used for final package removal, glass passivation layer removal, deep etching, and general removal of surface contaminants in the semiconductor and materials failure-analysis fields.

Optional Turbo Pumping

The base system uses an external mechanical pump and requires a separate water recirculator or chiller for stage cooling. An integrated turbo pump and controller option is available for users needing higher vacuum performance without adding a second external pump.

Common Specifications

Model Comparison