Plasma Prep Jr. Barrel Microwave Plasma Etcher/Asher/Cleaner

Overview

The Plasma Prep Jr. is an economical, microwave-based barrel plasma etcher, asher, and cleaner used to remove organics and some inorganics, along with their oxides, from metals, semiconductors, and ceramics. Compared to RF plasma systems, it operates at higher gas pressures for faster etch rates and greater sample throughput, at the cost of less discrimination between materials. Its Pyrex chamber measures 4 inches in diameter by 6 inches in length, and a water-cooled reactor configuration allows sample heating to be economically maintained between room temperature and 150 degrees C. Because samples can reach relatively high temperatures during processing, the system is generally not recommended for polymers, though power can be reduced to limit heating for more sensitive materials. A range of accessories, including a gas controller, ion trap, water recirculator, and process platform, extend the base system's capability.

Microwave Plasma Technology

Using microwave energy rather than RF power, the Plasma Prep Jr. bleeds in a gas chosen for the etch chemistry required, such as oxygen for organic removal or carbon tetrafluoride for passivation layer removal on electronic devices. This approach delivers more power for less cost than comparable RF systems.

Fast Etch Rates, Higher Throughput

Because it operates at higher gas pressures than RF plasma etchers, the Plasma Prep Jr. achieves faster etch rates and greater sample throughput, though with less discrimination when contrast is being sought through differential etch rates.

Water-Cooled Reactor Option

A water-cooled reactor configuration, available in standard and large chamber sizes, allows sample heating to be economically controlled from room temperature up to 150 degrees C, extending the system to more temperature-sensitive work.

Modular Accessories

Optional accessories sold separately include a water recirculator for independence from building water lines, an ion trap that shields samples from plasma sputtering, a gas controller housing vacuum and gas controls, and a process platform with special tongs for easier sample handling.

Common Specifications

Model Comparison